【05/05更新】(株)ＲＳ　Ｔｅｃｈｎｏｌｏｇｉｅｓ【3445】に注目！？今後の値動きはどうなる？掲示板の反応まとめ。

安かろう悪かろう

4月しっかり締めろ。

次の暴落があるかな。

そろそろかな？

底でガッチリ買いました。しばらく様子見。

アニュアルレポート2024
が出ていますね

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

Trump: There can be a SLOWING of the economy unless Mr. Too Late, a major loser, lowers interest rates, NOW.
トランプ遅すぎた大負け組が今すぐ金利を下げない限り、経済は減速する可能性がある。

こいつに恨まれたら一生続くみたいだ(´・ω・｀)

ロイター@ReutersJapan
トランプ氏は17日、「私は（関税を）これ以上高くしたくないかもしれないし、（予定している）水準まで引き上げたくないかもしれない。もっと低い水準にしたいかもしれない。なぜなら人々には買ってもらいたいし、ある時点を超えると買ってもらえなくなるからだ」と語った。

リリースが出ています
譲渡制限付株式報酬としての新株式発行に関するお知らせ

稚魚 ◆ENE/5a1nu. のプロファイリング
5chの株板荒らし
本名ゆうき
居住地　宮崎
学歴は高卒で株をやっている
趣味は筋トレでベンチ100kg持てるようになった
エニタイムフィットネスに在籍
一時期ギターに手を出していたが挫折
実家暮らしで家に入れてる金は15000円
2025年で満30歳
三交代制の工場勤務
職場の雰囲気は緩い
自称ワキガ
禁酒中
たまに友人と福岡へ遊びに行く
マッチングアプリのpairsに登録しているが現在まで彼女はできず

ゼンムいつS安きてもおかしくないのによく買えるな
これなら雑技団のほうがよっぽどリスクないわ
知らんけどRSIずーっと95以上ありそう

小さいがRS前進。

Dodgers Day Off - Tokyo, Japan
https://www.youtube.com/watch?v=hTwU7-bapAY

むっちゃ楽しんでるｗｗｗ(´・ω・｀)

CNBC:PRESIDENT TRUMP HAS SPOKEN WITH FORMER FED GOVERNOR WARSH ABOUT REPLACING POWELL - WSJ(´・ω・｀)

今夜はスレが雰囲気よくて居心地がいいと思ったら
道神 ◆8RSXM2T7c6がいないからか(´･ω･｀)

稚魚 ◆ENE/5a1nu. のプロファイリング
5chの株板荒らし
本名ゆうき
居住地　宮崎
学歴は高卒で株をやっている
趣味は筋トレでベンチ100kg持てるようになった
エニタイムフィットネスに在籍
一時期ギターに手を出していたが挫折
実家暮らしで家に入れてる金は15000円
2025年で満30歳
三交代制の工場勤務
職場の雰囲気は緩い
自称ワキガ
たまに友人と福岡へ遊びに行く
マッチングアプリのpairsに登録しているが現在まで彼女はできず

FinancialJuice
@financialjuice
China March survey-based jobless rate for 16-24 years old, excluding college students
at 16.5% vs 16.9% in previous month - Stats Bureau.
中国3月の調査に基づく16～24歳の失業率（大学生を除く）は16.5％で、
前月の16.9％から低下した - 国家統計局。

低下したとしても、公表数字でこの数字だと、日本の就職氷河期の頃より悪いのね　(´・ω・`)

>>989


クラウディア
743+1
山師さん
sage
04/17(木) 10:46:32.28
ID:kiORSjMz
3

雑技団は東証公認だぞ
845
山師さん
sage
04/17(木) 10:57:06.62
ID:kiORSjMz

雑技団乞食が高値圏で放置されるのは快感でつw
854
山師さん
sage
04/17(木) 10:58:32.17
ID:kiORSjMz

キャンディル
901
山師さん
sage
04/17(木) 11:03:33.95
ID:kiORSjMz

昨日忠告したよな
「雑技団は今日で終わりだと」
しゃぶり尽くされた雑技団銘柄に依存してるイナゴ虫
わろたw
938
山師さん
sage
04/17(木) 11:07:35.15
ID:kiORSjMz

オーミケンシ太洋テクノヤマザキパン本仕込み奴
シリウスの星
わろたw
989
山師さん
sage
04/17(木) 11:11:30.27
ID:kiORSjMz

東証公認雑技団のオシゴトは暴落前の水準に戻すことです

>>743

雑技団の回し者？

山師さん
sage
04/17(木) 09:33:12.93
ID:kiORSjMz

雑技団乞食くんラピーヌきたよw
50
山師さん
sage
04/17(木) 09:34:48.27
ID:kiORSjMz

豊和工業強いw
81
山師さん
sage
04/17(木) 09:37:39.25
ID:kiORSjMz

田谷↑
231
山師さん
sage
04/17(木) 09:52:41.61
ID:kiORSjMz

キューブにきてんねw
634
山師さん
sage
04/17(木) 10:32:14.68
ID:kiORSjMz

雑技団のオシゴトは暴落前の水準まで株価を戻すのことです
640
山師さん
sage
04/17(木) 10:33:50.31
ID:kiORSjMz

8209ってただの仕手だろ
676
山師さん
sage
04/17(木) 10:36:41.68
ID:kiORSjMz

クラウディア
743
山師さん
sage
04/17(木) 10:46:32.28
ID:kiORSjMz

雑技団は東証公認だぞ

<RTRS>
赤沢経済再生担当大臣：
・トランプとの会談、ベッセント米財務長官とグリアＵＳＴＲ代表も参加
・日米協議では米関税極めて遺憾と伝え、見直し求めた
・次回協議、今月中目指す
・双方が建設的に議論し首脳間で発表できるよう目指す

買え買え😡

マイク・リー上院議員がIRSとFRBの廃止を要求

みなさんおはにょー(´・ω・｀)

FORD TELLS DEALERS IT MAY RAISE PRICES IN MAY IF TARIFFS CONTINUE - AUTOMOTIVE NEWS
フォード、関税継続なら5月に値上げの可能性をディーラーに通告 - 自動車ニュース

ギブアーーーーップ(´・ω・｀)

フォードのフォーカスRSを輸入しろ

BOJ SET TO CUT GROWTH FORECAST FOR CURRENT FISCAL YEAR: RTRS
日銀、今年度の成長率予想を下方修正へ：RTRS

あんまり関係ないか(´・ω・｀)

そろそろ枚数増やそうかな〜

The Economic Club of Chicago
Hon. Jerome H. Powell, Chair, Board of Governors of the Federal Reserve System, 4/16/25
https://www.youtube.com/live/1o_9kO0zZQg?si=tUPRYwEho2vvQb98

17日2:25からスタート　(´・ω・`)

Many investors will exit the market.
It will be a veritable sea of ​​blood.
Institutional speculation around the world is fleeing the stock market.
The real crash is yet to come!! Run!! The Death Cross has appeared!!

Institutional investors are increasing their cash ratios; the real crash may be delayed

EU's Trade Chief Sefcovic left the meeting with little clarity on the US stance,
struggling to determine the American side’s aims, according to people familiar
with the talks. He met for about two hours with US Commerce Secretary
Lutnick and USTR Greer in Washington Monday.

欧州連合（EU）のセフコビ○チ通商部長は、アメリカ側の狙いを見極めるのに苦慮し、
アメリカ側の姿勢をほとんど明確にしないまま会談を終えた。
月曜日にワシントンでルトニック米商務長官、グリア米通商代表部（USTR）と約2時間会談した。

EU破談かもしれないってよ(´・ω・｀)

中国の関税回避のため、中国では中国産ウエハーが使われることになりそうです。